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Diamond – The "Ultimate Material" for Next-Generation AI Heat Dissipation

2026-08-06

Why is Diamond the "Ultimate Thermal Management Material"?

Thermal Conductivity Ceiling: High-quality CVD diamond achieves a thermal conductivity of 2,000–2,200 W/(m·K), which is 4–5 times that of copper and 13–15 times that of silicon — making it the thermal conductivity ceiling among bulk solid materials.
Electrically Insulating & Leakage-Free: With extremely high electrical resistivity, CVD diamond can be directly mounted on chip surfaces without requiring an additional insulating layer.
Excellent Thermal Matching: Its coefficient of thermal expansion (CTE) closely matches that of silicon, effectively reducing thermal stress‑induced damage.

These exceptional properties are made possible through Chemical Vapor Deposition (CVD) technology for producing diamond heat spreaders.

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Zhuzhou Ruideer Metallurgy Equipment Manufacturing Co.,Ltd

Zhuzhou Ruideer is a professional manufacturer in PM industry, specializing in producing sintering furnaces.

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